concrete slurry pump

CMP Slurry Delivery - Levitronix

Reduced Slurry Aggregation in CMP

Chemical Mechanical Planarization (CMP) must continuously improve to meet the stringent requirements of next generation IC device manufacturing. The consistency of the slurry is essential to achieve high process repeatability and uniformity. Compared to Levitronix® pumps, pneumatic pumps can cause shear stress due to check valves and other components. Shear stress in pumps can cause slurry agglomeration. Agglomerated slurry particles can lead to micro scratches, which cause wafer defectivity in CMP. Furthermore, Slurry agglomerates result in quick filter clogging, leading to increased maintenance costs.

Levitronix® pump systems are designed for demanding CMP applications where reduced particle agglomeration ensures the highest yield.

Benefits

Reduced Slurry Agglomeration

Low shear pump principle

The magnetic levitation technology guarantees that no pump components contact one another, enabling the gentle processing of delicate slurries. The smooth wetted plastic surfaces and the absence of a mechanical bearing, narrow gaps, fissures, and dead-zones ensure the highest standards of slurry health during its lifecycle.

Increased Filter Lifetime

Reduced clogging caused by slurry agglomerates

The lifetime of a CMP filter is directly linked with the concentration of large particles in the slurry. As the concentration of large particles of CMP slurry tends to increase in bellows and diaphragm pumps, the filter lifetime can be significantly prolonged with Levitronix® pumps.

Products

Microelectronics Pumps

Ultrapure Bearingless Pump Systems

Microelectronics Flow Controllers

Ultrapure Bearingless Flow Controllers

Microelectronics Inline Flow Sensors

PFA Ultrasonic Inline Flow Sensors

Microelectronics Clamp-On Flow Sensors

Non-Invasive Ultrasonic Flow Sensors for PFA Tubing

Microelectronics Pump Tank Mixers

Simultaneous Mixing and Pumping

Pressure Boosting System

Turnkey Pressure Boosting and Control