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4860–4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
4870–4875 Sn60/Pb40 No-Clean Solder Wire is electronics grade solder wire. The 60/40 solder uses a classic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, spatter-proof resin flux core. Our 60/40 tin-lead solder wire meets J-STD-004B, ASTM B 32 and J-STD-006C specifications. It melts at a slightly higher temperature, and over a wider temperature range, than classic 63/37 solder. It is the best 60/40 solder for creating robust and reliable joints that are highly resistant to whisker formation.
4880–4888 Sn63/Pb37 RA Solder Wire is electronics grade solder wire. This 63/37 solder uses the eutectic tin-to-lead alloy ratio, which is complemented with an RA-like flux core. This tin-lead solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
4890–4898 Sn60/Pb40 RA Solder Wire is electronics grade solder wire. The 60/40 rosin core solder uses a classic tin-to-lead alloy ratio complemented by a RA-like flux core. This solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It melts at slightly higher temperatures and over a wider temperature range than 63/37 solder. This results in robust and reliable joints that are highly resistant to whisker formation.
4900 SAC305 No-Clean Solder Wire is electronics grade solder wire. This lead-free solder uses the predominant lead-free alloy composition, exceeds J-STD-006C and meets ASTM B 32 purity specifications. It is complemented with a no-clean, synthetically refined, spatter-proof resin flux core that is classified as REL0 according to J-STD-004B. This solder is a great alternative to leaded solders.
4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.
49500WS Sn100e Water Soluble Solder Wire is an electronics grade solder wire. It uses a high-purity, eutectic 99.5% tin / 0.5% copper and cobalt alloy, complemented by a water-soluble flux core. 49500WS solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.
4860–4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
4870–4875 Sn60/Pb40 No-Clean Solder Wire is electronics grade solder wire. The 60/40 solder uses a classic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, spatter-proof resin flux core. Our 60/40 tin-lead solder wire meets J-STD-004B, ASTM B 32 and J-STD-006C specifications. It melts at a slightly higher temperature, and over a wider temperature range, than classic 63/37 solder. It is the best 60/40 solder for creating robust and reliable joints that are highly resistant to whisker formation.
4880–4888 Sn63/Pb37 RA Solder Wire is electronics grade solder wire. This 63/37 solder uses the eutectic tin-to-lead alloy ratio, which is complemented with an RA-like flux core. This tin-lead solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
4890–4898 Sn60/Pb40 RA Solder Wire is electronics grade solder wire. The 60/40 rosin core solder uses a classic tin-to-lead alloy ratio complemented by a RA-like flux core. This solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It melts at slightly higher temperatures and over a wider temperature range than 63/37 solder. This results in robust and reliable joints that are highly resistant to whisker formation.
4900 SAC305 No-Clean Solder Wire is electronics grade solder wire. This lead-free solder uses the predominant lead-free alloy composition, exceeds J-STD-006C and meets ASTM B 32 purity specifications. It is complemented with a no-clean, synthetically refined, spatter-proof resin flux core that is classified as REL0 according to J-STD-004B. This solder is a great alternative to leaded solders.
4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.
49500WS Sn100e Water Soluble Solder Wire is an electronics grade solder wire. It uses a high-purity, eutectic 99.5% tin / 0.5% copper and cobalt alloy, complemented by a water-soluble flux core. 49500WS solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.
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